Qingdao Gaoce Technology Co.,Ltd

Individual company presentation

Gaoce Group was established in 2006 and entered A-share market of Science and Technology Innovation Board in 2020.Gaoce is mainly engaged in R&D, production, sales and supporting services of hard brittle material cutting equipment and cutting consumables. Gaoce mainly provides solutions for "cutting, squaring, grinding & polishing, and slicing" from silicon rods to silicon wafers for photovoltaic industry manufacturers based on independent core technology. Our customers cover the top ten global silicon wafer manufacturers in the photovoltaic industry. Gaoce has continuousty promoted R&D and industrial application of diamond wire cutting technology in the processing of more and more high hardness and brittleness materials such as semiconductor silicon wafer, silicon carbide, sapphire,magnetic materials, etc. since 2018, which has been selected and recognized by leading enterprises in the industry.Gaoce expanded the silicon, wafer cutting and processing services in 2021,Gaoce adheres to promoting industrial structure optimization and upgrading through technological innovation.It has established R&D centers in Qingdao, Luoyang,Chengdu and other places, focusing on R&D of cutting equipment and core component bearing boxes,R&D of diamond wire process, and comprehensive independent R&D of slicing process.Gaoce will always be committed to "Building world-class cutting service provider for hard and brittle materials"continue to create value for customers, and help the world achieve carbon emission peak carbon neutrality.

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