Enhanced Characterization Techniques Across Wafer, Cell, and Module Production Lines

Thursday, June 20, 2024

Time
01:00 pm - 02:45 pm
Hall
Messe München
Room
Hall A2, Booth A2.409

Quality assurance in wafer, cell, and module production hinges on efficient characterization processes. Precise measurements and identification of defective products are crucial for cost savings. Characterization enhances throughput and facilitate sorting based on performance metrics, making advancements in software and automation solutions imperative. Machine learning and digitalization play key roles in bolstering the robustness and efficiency of production lines and are widely adopted within the industry. In this session, companies will provide the latest advancements in the realm, while others will showcase how they track the quality of their products. The topic of quality assurance through tracked metrology will be discussed.

01:00 pm - 01:15 pmHigh Speed Cell and Module Quality Inspection Based on Electroluminescence Imaging and AI Optimized Algorithms

Mr. Matthias Krinke, Geschäftsführender Gesellschafter, pi4 robotics GmbH

01:15 pm - 01:30 pmInnovative Device Characterization Solutions

Klaus Ramspeck, Director R&D, halm elektronik GmbH

01:30 pm - 01:45 pmIV-Testing and Tandem/Perovskite: Scaling up from Cell Level to Full Size Module Production

01:45 pm - 02:00 pmVDMA China in a Nutshell

Mr. Han Chen, Project Manager, German Mechanical Engineering Commercial Services (Beijing)

02:00 pm - 02:15 pmDeep Learning Defect Detection

02:15 pm - 02:30 pmInnovations for R&D and End-of-Line Testing

Mr. Bernhard Mitchell, Lead Innovation Management, WAVELABS Solar Metrology Systems GmbH

02:30 pm - 02:45 pmLUMI-Q: The New System Platform for Photoluminescence Inspections in Cell and Module Manufacturing

Mr. Peter Handschack, VP Business Unit Solar, ISRA VISION GmbH

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