Individual company presentation

Gaoce Group was established in October 2006 and listed in A-share market of the Science and Technology Innovation Board on August 7,2020(stock code:688556). Headquartered in Qingdao High-tech Industrial Development Zone, Gaoce is mainly engaged in R&D, production, sales and supporting services of hard brittle material cutting equipment and cutting consumables.

Gaoce adheres to R&D driven development, and has established collaborative R&D and technological closed-loop advantage in "Cutting equipment, cutting consumables, and cutting process", providing integrated solutions for "cutting equipment, cutting consumables, and wafer cutting and processing services" for customers in the photovoltaic industry. The top ten global wafer manufacturers in the industry are Gaoce customers. Seizing the new opportunity of high-quality silicon wafer foundation, Gaoce expanded its silicon wafer cutting and processing service business in 2021, providing customers with large-scale solutions for silicon wafer cutting.

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Floorplan Booth

A3.330